IPC IPC 6012D:2015

IPC 6012D:2015 PDF Download

Standard EN Sample 1 Sample 2

Qualification and Performance Specification for Rigid Printed Boards

SKU913316616 Published by IPC International Inc, formerly Institute for Printed Circuits IPC Publication Date2015-09-01 Pages CountPages136

IPC 6012D:2015 is a standard that specifies the qualification and performance requirements for rigid printed boards. This standard applies to various types of rigid printed boards, including single-sided, double-sided, and multilayer boards with or without plated-through holes and blind/buried vias. It also covers metal core boards.

The standard addresses several aspects of rigid printed boards, such as final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing, and quality conformance. It also includes electrical, mechanical, and environmental requirements that the boards must meet.

In the revised version D of the standard, there are new requirements introduced. These include aspects like HASL coatings, alternative surface finishes, edge plating, marking, microvia capture and target lands, copper cap plating of filled holes, copper filled microvias, and dielectric removal. The standard is intended to be used in conjunction with IPC-6011 and supersedes the previous versions IPC-6012C and IPC-6016.

Details History and complementary documents History
Language(s)English
ISBN978-1-61193-208-9
File Size11.3 MB
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