IPC SM-784:1990 PDF Download

The IPC SM-784:1990 standard is a comprehensive document that provides guidance on the implementation of Chip on Board (COB) technology. The standard covers various aspects of COB applications, including chip types, board selection, design issues, and thermal transfer methods.

One of the key areas covered in this standard is the different chip types that can be used in COB applications. It provides information on wire bonding, Tape Automated Bonding (TAB), and flip chip designs, highlighting the advantages and considerations for each type.

The standard also addresses the selection of the board for COB applications, emphasizing the importance of considering factors such as material compatibility, mechanical strength, and electrical performance. It provides guidelines on how to choose the appropriate board based on the specific requirements of the COB design.

Additionally, the IPC SM-784:1990 standard discusses various mounting materials used in COB applications, including adhesives, wires, and mechanical bonding techniques. It provides information on the characteristics and considerations for each material, helping designers make informed decisions.