IPC HDBK-850:2012 PDF Download

The IPC HDBK-850:2012 standard offers guidance to designers and users of potting and encapsulation materials in the electronics industry. Its purpose is to help readers comprehend the characteristics of different materials and the variables that can influence these properties during the potting or encapsulation process. Furthermore, the handbook covers the equipment and techniques involved in preparing and applying potting and encapsulation materials.

One of the challenges addressed in this handbook is the lack of a clear industry definition distinguishing between potting and encapsulation. To address this issue, the document employs terminology specific to electronic printed circuit board assembly and protection processes, such as glob-top and dam-and-fill methods. By understanding and considering the properties of potting and encapsulation materials, users can ensure the reliability and functionality of electronics.