Specifications for Particular Types of Winding Wires - Part 0-1: General Requirements - Enamelled Round Copper Wire
Also Known As:
IEC 60317-0-1:2008 is a standard that provides general requirements for enamelled round copper winding wires. The standard covers various aspects such as the presence of a bonding layer, minimum insulation, maximum overall diameters, dielectric breakdown requirements, and pin hole test for polyurethane wires.
One of the key changes in the updated version of the standard is the addition of Grade 3 minimum insulation and maximum overall diameters for wires up to 0.071 mm nominal conductor diameter. Additionally, revisions have been made to the minimum increase in bonding layer for wires up to 0.100 mm nominal conductor diameter.
It is important to note that this standard should be used in conjunction with the IEC 60851 series, as the clause numbers used in IEC 60317-0-1:2008 correspond to the respective test numbers in IEC 60851. This ensures that all the necessary requirements are met and the wires conform to international standards.
| Edition | 3.0 |
| ICS Codes | 29.060.10 - Wires |
| Language(s) | English + French |
| File Size | 993.3 KB |
